Posted by Stub Mandrel on 05/04/2012 22:28:24:
I'm always impressed by all those electronic components with legs at 2.54mm and 1.27mm spacing
Not any more; legs are so yesterday! I've just finished designing a fairly complex board and only one IC had a lead pitch of 1.27mm, and none at 2.54mm. The majority of ICs didn't have any legs, being either BGAs (ball grid array) or LCCs (leadless chip carriers). The only big ICs that had legs were the Ethernet MAC/PHY and Ethernet switch at, I think, 0.65mm, which is of course 25 thou. All the other ICs with legs were 0.5mm. The use of BGAs is pretty much universal now, and not just for the larger ICs.
BGAs are used for several reasons. For large numbers of connections the packages are much smaller than equivalent leaded components. For example the processor we used had 423 connections, and that's a fairly low number. Even at 0.5mm lead spacing that's a big component. A large leaded package is more expensive to make and requires stamped out lead frames. Also, a large leaded package has significant time delays and parasitics associated with leads in the corners of the package.
If you think components are an odd mix of units, then PCBs are worse. Thickness and size can be metric or imperial, or both, depending on the final customer. Via holes are normally metric, but track and gap design rules are often imperial. To cap it all the copper on each layer is specified by weight. On the PCB mentioned above all layers used 0.5oz copper. That indicates the weight of copper used to cover 1 square foot of PCB, in our case the copper is 17.5 microns thick.
Regards,
Andrew
PS: Sorry about the off topic 'lecture'; it's been a hard few weeks!